Metallurgical Engineering

Metallurgical Engineering

Synthesis of copper powder with different morphologies by electrochemical dissolution of brass alloy scrap and deposition of copper powder in the cathode

Document Type : Research Paper

Authors
1 Assistant Professor, Department of Metallurgy and Materials Engineering, Hamedan University of Technology, Hamedan, Iran.
2 Assistant Professor, Department of Metallurgy and Materials Engineering Hamedan Engineering, University of Technology, Hamedan, Iran.
3 M.Sc., Department of Metallurgy and Materials Engineering. Hamedan University of Technology, Hamedan, Iran.
Abstract
The effect of different additives on simultaneous electrochemical dissolution and precipitation of copper from brass scrap in H2SO4 solution with a constant current density (250 A/m2) and ambient temperature has been investigated. The additives included chloride ion , nitrate ion, iron (II) and ammonium. Thermodynamic calculations of the electrochemical dissolution process and dominant species in the presence and absence of additives were analyzed. The changes in voltage and its percentage as well as the morphology of copper deposited on the cathode were investigated in the presence and absence of these additives. According to the results, with the increase in concentration of sulfuric acid, the amount of voltage required to provide the current density of 250 A/m2 decreases. The presence of chloride ions in electrolytes containing sulfuric acid with a concentration higher than 50 g/l increases the process voltage. Also, in the presence of chloride ion, cubic morphology is obtained. Nitrate ion, like chloride ion, in low concentrations of sulfuric acid causes a decrease in the copper reduction voltage in the cathode, and vice versa, in higher concentrations of sulfuric acid, an increase in voltage is observed. Also, by adding nitrate ion, an octahedral structure is created with preferential growth of {100} and {110} planes. The dissolution and electrochemical deposition of copper in the presence of iron (II) is associated with an increase in voltage and creates a completely disordered and dendritic structure. Adding ammonium ion to sulfuric acid increases the voltage required and creates a cubic structure.
Keywords

[1]      Karimi S, Ashtari P, Rafatinia M, Mohammad-Alizadeh Z, Akbari M, Ghasemi S. Replacement of the Chloride Washing Process in the Recovery of Zinc From Steel-MakingDust with an Environmentally Friendly Method Based on Solvent Extraction. Metallurgical Engineering
2022: 24(4): 276-285 http://dx.doi.org/10.22076/ME.2023.560065.1358
[2]      P. Khanmohammadi Hazaveh, S. Karimi, F. Rashchi, S. Sheibani, Purification of the leaching solution of recycling zinc from the hazardous electric arc furnace dust through an as-bearing jarosite, Ecotoxicol Environ Saf. 202 (2020). https://doi.org/10.1016/j.ecoenv.2020.110893.
[3]      S. Vaghar, S. Ghasemi, M. Pourabdoli, Anodic dissolution of waste brass chips in sulfuric acid for the recovery of copper and zinc, International Journal of Environmental Science and Technology. 19 (2022) 10933–10944. https://doi.org/10.1007/s13762-022-04297-3.
[4]      P. Sarfo, A. Das, G. Wyss, C. Young, Recovery of metal values from copper slag and reuse of residual secondary slag, Waste Management. 70 (2017). https://doi.org/10.1016/j.wasman.2017.09.024.
[5]      E.S. Kondratyeva, A.F. Gubin, V.A. Kolesnikov, Principal processing flowsheet of copper–brass wastes of metallurgical brass production, Russian Journal of Non-Ferrous Metals. 58 (2017). https://doi.org/10.3103/S1067821217030075.
[6]      J.M. Martins, A.S. Guimarães, A.J.B. Dutra, M.B. Mansur, Hydrometallurgical separation of zinc and copper from waste brass ashes using solvent extraction with D2EHPA, Journal of Materials Research and Technology. 9 (2020) 2319–2330. https://doi.org/10.1016/j.jmrt.2019.12.063.
[7]      A.H. Kaksonen, S. Särkijärvi, E. Peuraniemi, S. Junnikkala, J.A. Puhakka, O.H. Tuovinen, Metal biorecovery in acid solutions from a copper smelter slag, Hydrometallurgy. 168 (2017) 135–140. https://doi.org/10.1016/j.hydromet.2016.08.014.
[8]      G. Shi, Y. Liao, B. Su, Y. Zhang, W. Wang, J. Xi, Kinetics of copper extraction from copper smelting slag by pressure oxidative leaching with sulfuric acid, Sep Purif Technol. 241 (2020) 116699. https://doi.org/10.1016/j.seppur.2020.116699.
[9]      L. Qiang, I.S.S. Pinto, Zhao Youcai, Sequential stepwise recovery of selected metals from flue dusts of secondary copper smelting, J Clean Prod. 84 (2014) 663–670. https://doi.org/10.1016/j.jclepro.2014.03.085.
[10]    R.K. Nadirov, M.D. Turan, G.A. Karamyrzayev, Copper ammonia leaching from smelter slag, International Journal of Biology and Chemistry. 12 (2019) 135–140. https://doi.org/10.26577/ijbch-2019-i2-18.
[11]    S. Roy, S. Sarkar, A. Datta, S. Rehani, Importance of mineralogy and reaction kinetics for selecting leaching methods of copper from copper smelter slag, Sep Sci Technol. 51 (2016) 135–146. https://doi.org/10.1080/01496395.2015.1073309.
[12]    M. Aghazadeh, A. Zakeri, M.Sh. Bafghi, Modeling and optimization of surface quality of copper deposits recovered from brass scrap by direct electrowinning, Hydrometallurgy. 111–112 (2012) 103–108. https://doi.org/10.1016/j.hydromet.2011.11.001.
[13]    A. Chateauminois, ASM Handbook: Surface Engineering (Vol 5), Tribol Int. 33 (2000) 67. https://doi.org/10.1016/S0301-679X(00)00006-2.
[14]    M. Schlesinger, M. King, K. Sole, W. Davenport, Extractive Metallurgy of Copper, Elsevier, 2011. https://doi.org/10.1016/C2010-0-64841-3.
[15]    Y. Wang, B. Li, Y. Wei, H. Wang, Effect of Zn2+ on the extraction of copper by cyclone electrowinning from simulated copper-containing electrolyte, Sep Purif Technol. 282 (2022) 120014. https://doi.org/10.1016/j.seppur.2021.120014.
[16]    M. Mallik, A. Mitra, S. Sengupta, K. Das, R.N. Ghosh, S. Das, Effect of current density on the nucleation and growth of crystal facets during pulse electrodeposition of Sn-Cu lead-free solder, Cryst Growth Des. 14 (2014). https://doi.org/10.1021/cg501440a.
[17]    S. Banthia, S. Sengupta, M. Mallik, S. Das, K. Das, Substrate effect on electrodeposited copper morphology and crystal shapes, Surface Engineering. 34 (2018). https://doi.org/10.1080/02670844.2017.1321265.
[18]    V.K. Sheleg, M.A. Levantsevich, E. v. Pilipchuk, R.R. Dema, Study of the Performance of Copper Coatings Formed by Electroplating and Deformation Cladding with a Flexible Tool, Journal of Friction and Wear. 39 (2018). https://doi.org/10.3103/S1068366618010117.
[19]    M.G. Pavlović, L.J. Pavlović, V.M. Maksimović, N.D. Nikolićand, K.I. Popov, Characterization and morphology of copper powder particles as a function of different electrolytic regimes, Int J Electrochem Sci. 5 (2010).
[20]    H.C. Shin, J. Dong, M. Liu, Nanoporous Structures Prepared by an Electrochemical Deposition Process, Advanced Materials. 15 (2003). https://doi.org/10.1002/adma.200305160.
[21]    Q. Zhu, X. Sun, D. Yang, J. Ma, X. Kang, L. Zheng, J. Zhang, Z. Wu, B. Han, Carbon dioxide electroreduction to C2 products over copper-cuprous oxide derived from electrosynthesized copper complex, Nat Commun. 10 (2019). https://doi.org/10.1038/s41467-019-11599-7.
[22]    R. Johnsan, S. Das, C.S. Sujith Kumar, Changes in the Wettability of Microporous Copper Layers Prepared by Different Modes of Electrodeposition, Chem Eng Technol. 44 (2021). https://doi.org/10.1002/ceat.202100026.
[23]    O. Gladysz, P. Los, E. Krzyzak, Influence of concentrations of copper, levelling agents and temperature on the diffusion coefficient of cupric ions in industrial electro-refining electrolytes, J Appl Electrochem. 37 (2007) 1093–1097. https://doi.org/10.1007/s10800-007-9363-8.
[24]    M.G. Pavlovic, Lj.J. Pavlovic, E.R. Ivanovic, V. Radmilovic, K.I. Popov, The effect of particle structure on apparent density of electrolytic copper powder, Journal of the Serbian Chemical Society. 66 (2001) 923–933. https://doi.org/10.2298/JSC0112923P.
[25]    M.G. Pavlović, Lj.J. Pavlović, N.D. Nikolić, K.I. Popov, The Effect of Some Parameters of Electrolysis on Apparent Density of Electrolytic Copper Powder in Galvanostatic Deposition, Materials Science Forum. 352 (2000) 65–72. https://doi.org/10.4028/www.scientific.net/MSF.352.65.
[26]    A. Ďurišinová, Factors Influencing Quality of Electrolytic Copper Powder, Powder Metallurgy. 34 (1991) 139–141. https://doi.org/10.1179/pom.1991.34.2.139.
[27]    K. Popov, S. Krstic, M. Obradovic, M. Pavlovic, L. Pavlovic, E. Ivanovic, The effect of the particle shape and structure on the flowability of electrolytic copper powder. III. Amodel of the surface of a representative particle of flowing copper powder electrodeposited by re, Journal of the Serbian Chemical Society. 69 (2004) 43–51. https://doi.org/10.2298/JSC0401043P.
[28]    K. Popov, M. Pavlovic, L. Pavlovic, E. Ivanovic, S. Krstic, M. Obradovic, The effect of the particle shape and structure on the flow ability of electrolytic copper powder II: The experimental verification of the model of the representative powder particle, Journal of the Serbian Chemical Society. 68 (2003) 779–783. https://doi.org/10.2298/JSC0310779P.
[29]    Y. Zhao, J. Zhao, D. Ma, Y. Li, X. Hao, L. Li, C. Yu, L. Zhang, Y. Lu, Z. Wang, Synthesis, growth mechanism of different Cu nanostructures and their application for non-enzymatic glucose sensing, Colloids Surf A Physicochem Eng Asp. 409 (2012) 105–111. https://doi.org/10.1016/j.colsurfa.2012.05.045.
[30]    U. Rasool, S. Hemalatha, Marine endophytic actinomycetes assisted synthesis of copper nanoparticles (CuNPs): Characterization and antibacterial efficacy against human pathogens, Mater Lett. 194 (2017) 176–180. https://doi.org/10.1016/j.matlet.2017.02.055.
[31]    Y. Savelyev, A. Gonchar, B. Movchan, A. Gornostay, S. Vozianov, A. Rudenko, R. Rozhnova, T. Travinskaya, Antibacterial polyurethane materials with silver and copper nanoparticles, Mater Today Proc. 4 (2017) 87–94. https://doi.org/10.1016/j.matpr.2017.01.196.
[32]    K. Ahn, K. Kim, J. Kim, Thermal conductivity and electric properties of epoxy composites filled with TiO2-coated copper nanowire, Polymer (Guildf). 76 (2015) 313–320. https://doi.org/10.1016/j.polymer.2015.09.001.
[33]    P. Zhang, Q. Li, Y. Xuan, Thermal contact resistance of epoxy composites incorporated with nano-copper particles and the multi-walled carbon nanotubes, Compos Part A Appl Sci Manuf. 57 (2014) 1–7. https://doi.org/10.1016/j.compositesa.2013.10.022.
[34]    F. Scholz, Active sites of heterogeneous nucleation understood as chemical reaction sites, Electrochem Commun. 13 (2011). https://doi.org/10.1016/j.elecom.2011.06.003.
[35]    K.S. Kumar, K. Biswas, Effect of thiourea on grain refinement and defect structure of the pulsed electrodeposited nanocrystalline copper, Surf Coat Technol. 214 (2013). https://doi.org/10.1016/j.surfcoat.2012.10.018.
[36]    N.D. Nikolić, V.M. Maksimović, M.G. Pavlović, K.I. Popov, Cross-section analysis of the morphology of electrodeposited copper obtained in the hydrogen co-deposition range, Journal of the Serbian Chemical Society. 74 (2009). https://doi.org/10.2298/JSC0906689N.
[37]    W. Schwarzacher, Electrodeposition: A technology for the future, Electrochemical Society Interface. 15 (2006). https://doi.org/10.1149/2.f08061if.
[38]    S.R. Hosseini, S. Ghasemi, S.A. Ghasemi, Effect of surfactants on electrocatalytic performance of copper nanoparticles for hydrogen evolution reaction, J Mol Liq. 222 (2016). https://doi.org/10.1016/j.molliq.2016.08.013.
[39]    S.A. Al-Thabaiti, M.A. Malik, A.A.O. Al-Youbi, Z. Khan, J.I. Hussain, Effects of surfactant and polymer on the morphology of advanced nanomaterials in aqueous solution, Int J Electrochem Sci. 8 (2013).
[40]    Sudibyo, Darmansyah, A. Junaedi, A.S. Handoko, F.K. Mufakhir, F. Nurjaman, M. Amin, Y.I. Supriyatna, S. Sumardi, P. Salsabila, Nickel recovery from electrocoagulation sludge of hydrometallurgy wastewater using electrowinning, in: AIP Conf Proc, 2020. https://doi.org/10.1063/5.0001929.
[41]    L. Tang, Dissolved Copper Removal by Electrowinning Process from Waste Brine Solution, (2018).
[42]    W. Zeng, S. Wang, M.L. Free, C.-J. Tang, R. Xiao, Y. Liang, Design and Modeling of an Innovative Copper Electrolytic Cell, J Electrochem Soc. 165 (2018). https://doi.org/10.1149/2.0841814jes.
[43]    N. Mkhawana, Effect of varying operating conditions on cathode surface roughness using guar as a smoothing agent in copper electrowinning, (2021).
[44]    P. Laforest, Understanding Impurities in copper electrometallurgy, Thesis. (2015).
[45]    M. Moats, Y. Khouraibchia, Effective diffusivity of ferric ions and current efficiency in stagnant synthetic copper electrowinning solutions, Minerals and Metallurgical Processing. 26 (2009). https://doi.org/10.1007/bf03402537.
[46]    M.S. Moats, A. Luyima, W. Cui, Examination of copper electrowinning smoothing agents. Part I: A review, Minerals and Metallurgical Processing. 33 (2016). https://doi.org/10.19150/mmp.6462.
[47]    D.L. Parkhurst, C.A.J. Appelo, PHREEQC (Version 3)-A Computer Program for Speciation, Batch-Reaction, One-Dimensional Transport, and Inverse Geochemical Calculations, Modeling Techniques, Book 6. (2013).
[48]    Effects of Metallurgical Variables on Dealloying Corrosion[1], in: Corrosion in the Petrochemical Industry, 2020. https://doi.org/10.31399/asm.tb.cpi2.t55030082.
[49]    D.R. Lide, CRC Handbook of Chemistry and Physics, Internet Version 2005, CRC Press, Taylor and Francis Boca Raton FL. (2005).
[50]    A. Kekki, J. Aromaa, O. Forsen, Copper deposition on stainless steel sheets in copper nitrate solution, Physicochemical Problems of Mineral Processing. 51 (2015). https://doi.org/10.5277/ppmp150122.
[51]    Z. Zhang, J. Werner, M. Free, A current efficiency prediction model based on electrode kinetics for iron and copper during copper electrowinning, in: Minerals, Metals and Materials Series, 2018. https://doi.org/10.1007/978-3-319-72131-6_10.
[52]    S.P. Sandoval, T.G. Robinson, P.R. Cook, Method and apparatus for electrowinning copper using the ferrous/ferric anode reaction, CA2533650C, 2003.
[53]    G. Cifuentes, J. Simpson, F. Lobos, L. Briones, A. Morales, An alternative copper electrowinning process based on reactive electrodialysis (RED), in: Chem Eng Trans, 2010. https://doi.org/10.3303/CET1019026.

  • Receive Date 15 October 2022
  • Revise Date 08 April 2023
  • Accept Date 06 May 2023