[1] J. R. Davis, Copper and copper alloys. ASM international, 2001.
[2] W. Blum and G. B. Hogaboom, “Principles of Electroplating and Electroforming (electrotyping),” 1949.
[3] A. D. G. Murrell, “A Study of Testing Different Mandrels for Electroforming Nickel.” Tennessee Technological University, 2017.
[4] J. A. McGeough, “Electroforming,” in CIRP Encyclopedia of Production Engineering, Springer, 2014, pp. 443–446.
[5] X.-Q. Yin et al., “Mechanical properties and microstructure of rolled and electrodeposited thin copper foil,” Rare Met., vol. 35, no. 12, pp. 909–914, 2016.
[6] I. Mladenović, J. Lamovec, V. Jović, and V. Radojević, “Synergetic effect of additives on the hardness and adhesion of thin electrodeposited copper films,” Serbian J. Electr. Eng., vol. 14, no. 1, pp. 1–11, 2017.
[7] S. Banthia, S. Sengupta, M. Mallik, S. Das, and K. Das, “Substrate effect on electrodeposited copper morphology and crystal shapes,” Surf. Eng., pp. 1–8, 2017.
[8] J. Niu et al., “Effect of Electrodeposition Parameters on the Morphology of Three-Dimensional Porous Copper Foams,” Int. J. Electrochem. Sci., vol. 10, pp. 7331–7340, 2015.
[9] A. Nevers, L. Hallez, F. Touyeras, and J.-Y. Hihn, “Effect of ultrasound on silver electrodeposition: Crystalline structure modification,” Ultrason. Sonochem., vol. 40, pp. 60–71, 2018.
[10] I. Belov, C. Zanella, C. Edström, and P. Leisner, “Finite element modeling of silver electrodeposition for evaluation of thickness distribution on complex geometries,” Mater. Des., vol. 90, pp. 693–703, 2016.
[11] M. Rosales and J. L. Nava, “Simulations of Turbulent Flow, Mass Transport, and Tertiary Current Distribution on the Cathode of a Rotating Cylinder Electrode Reactor in Continuous Operation Mode during Silver Deposition,” J. Electrochem. Soc., vol. 164, no. 11, pp. E3345–E3353, 2017.
[12] C. T. J. Low, E. P. L. Roberts, and F. C. Walsh, “Numerical simulation of the current, potential and concentration distributions along the cathode of a rotating cylinder Hull cell,” Electrochim. Acta, vol. 52, no. 11, pp. 3831–3840, 2007.
[13] T. Pérez and J. L. Nava, “Numerical simulation of the primary, secondary and tertiary current distributions on the cathode of a rotating cylinder electrode cell. Influence of using plates and a concentric cylinder as counter electrodes,” J. Electroanal. Chem., vol. 719, pp. 106–112, 2014.
[14] N. Obaid, R. Sivakumaran, J. Lui, and A. Okunade, “Modelling the Electroplating of Hexavalent Chromium,” in COMSOL Conference. Boston2013, 2013.
[15] T. Elshenawy, S. Soliman, and A. Hawwas, “Influence of electric current intensity on the performance of electroformed copper liner for shaped charge application,” Def. Technol., vol. 13, no. 6, pp. 439–442, 2017.
[16] M. Carpinella, M. I. Velasco, E. V Silletta, J. M. Ovejero, S. A. Dassie, and R. H. Acosta, “Determination of flow patterns in a rotating disk electrode configuration by MRI,” J. Electroanal. Chem., vol. 750, pp. 100–106, 2015.
[17] M. C. Devi, L. Rajendran, A. Bin Yousaf, and C. Fernandez, “Non-linear Differential Equations and Rotating Disc Electrodes: Pade approximationTechnique,” Electrochim. Acta, vol. 243, pp. 1–6, 2017.
[18] M. Robison and M. L. Free, “Modeling and experimental validation of electroplating deposit distributions from copper sulfate solutions,” ECS Trans., vol. 61, no. 21, pp. 27–36, 2014.
[19] L. Tong, “Tertiary current distributions on rotating electrodes,” in Proceedings of the COMSOL Conference, 2011.
[20] M. Eisenberg, C. W. Tobias, and C. R. Wilke, “Ionic mass transfer and concentration polarization at rotating electrodes,” J. Electrochem. Soc., vol. 101, no. 6, pp. 306–320, 1954.
[21] C. Madore, M. Matlosz, and D. Landolt, “Experimental investigation of the primary and secondary current distribution in a rotating cylinder Hull cell,” J. Appl. Electrochem., vol. 22, no. 12, pp. 1155–1160, 1992.
[22] A. Giaccherini et al., “Finite elements analysis of an electrochemical coating process of an irregularly shaped cathode with COMSOL Multiphysics®,” ECS Trans., vol. 64, no. 35, pp. 1–8, 2015.
[23] C. M. U. Guide, “Version 5.2, COMSOL Inc.,(2016),” Google Sch.
[24] A. Shukla, “Modeling and measuring electrodeposition parameters near electrode surfaces to facilitate cell performance optimization.” Department of Metallurgical Engineering, University of Utah, 2013.
[25] N. D. Nikolić, K. I. Popov, L. J. Pavlović, and M. G. Pavlović, “Morphologies of copper deposits obtained by the electrodeposition at high overpotentials,” Surf. Coatings Technol., vol. 201, no. 3–4, pp. 560–566, 2006.
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